The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Aug. 27, 2015
Applicant:

Joled Inc., Tokyo, JP;

Inventor:

Kouhei Koresawa, Kyoto, JP;

Assignee:

JOLED INC., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/32 (2006.01); H01L 51/05 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 27/322 (2013.01); H01L 27/3246 (2013.01); H01L 51/0541 (2013.01); H01L 27/3244 (2013.01); H01L 51/0545 (2013.01); H01L 51/56 (2013.01); H01L 2227/323 (2013.01);
Abstract

A display panel includes an EL panel section, a CF panel section, and a sealing resin layer. In the EL panel section, the surface of a sealing layer has a projected and recessed shape in a Z-axis direction as a whole, wherein a light-emitting region corresponding to a region between banks is a recessed section, and a non-light-emitting region corresponding to a top portion of the bank is a projected section. The sealing resin layer includes a first sealing resin layer and a second sealing resin layer. Prior to performing heating or light irradiation in a step of forming the first and second sealing resin layers, the viscosity of a second non-fluid resin constituting the second sealing resin layer is lower than the viscosity of a first non-fluid resin constituting the first sealing resin layer.


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