The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Aug. 04, 2016
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Jun Fujiki, Mie, JP;

Takeshi Kamigaichi, Yokkaichi, JP;

Hideaki Aochi, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/148 (2006.01); H01L 29/80 (2006.01); H01L 27/108 (2006.01); H01L 21/00 (2006.01); H01L 27/11582 (2017.01); H01L 27/11556 (2017.01); H01L 29/16 (2006.01); H01L 29/04 (2006.01); H01L 29/45 (2006.01); H01L 29/417 (2006.01); H01L 23/532 (2006.01); H01L 21/28 (2006.01); H01L 21/02 (2006.01); H01L 27/11519 (2017.01); H01L 27/11565 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/02532 (2013.01); H01L 21/02592 (2013.01); H01L 21/28273 (2013.01); H01L 21/28282 (2013.01); H01L 23/53204 (2013.01); H01L 27/11519 (2013.01); H01L 27/11556 (2013.01); H01L 27/11565 (2013.01); H01L 29/04 (2013.01); H01L 29/16 (2013.01); H01L 29/41741 (2013.01); H01L 29/456 (2013.01);
Abstract

One embodiment includes a plurality of memory cells and a plurality of conducting layers. The memory cells are three-dimensionally disposed on a semiconductor substrate. The conducting layers are disposed in a laminating direction. Each of the plurality of the conducting layers is connected to each of the plurality of the memory cells. Each conducting layer has a structure where a first conductive film and a second conductive film are laminated in the laminating direction. The conducting layers adjacent to one another in the laminating direction have a laminating order of the first conductive film and the second conductive film different from one another.


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