The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Jan. 28, 2015
Applicant:

Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v., München, DE;

Inventors:

Hans-Hermann Oppermann, Berlin, DE;

Kai Zoschke, Berlin, DE;

Lena Goullon, Berlin, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 21/6835 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/95 (2013.01); H01L 25/065 (2013.01); H01L 25/50 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83001 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/95001 (2013.01);
Abstract

A method for arranging electronic components that includes a plurality of electronic components pasted onto a first front face of a carrier having a bonding layer. The front face and/or the electronic components being provided with a plurality of bonding points and the diameter of and distance between the bonding points are selected such that each of the plurality of electronic components is attached by at least three bonding points to the carrier having the bonding layer. The method also includes arranging at least one portion of the plurality of the components on a switching element carrier and connecting the components to the carrier. The method also includes detaching a component from the carrier having a bonding layer, using a solvent or a mechanical force that separates the carrier having a bonding layer and the switching element carrier from one another.


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