The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2018
Filed:
Aug. 30, 2013
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventor:
Sang Jin Byeon, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 5/06 (2006.01); G06G 1/12 (2006.01); H01L 23/544 (2006.01); H01L 25/065 (2006.01); G11C 8/12 (2006.01); G11C 29/44 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 25/0657 (2013.01); G11C 8/12 (2013.01); G11C 2029/4402 (2013.01); H01L 2223/5444 (2013.01); H01L 2223/54473 (2013.01); H01L 2225/06527 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor apparatus includes a chip ID generation unit, a chip ID transmission unit and a chip stack information generation unit. The chip ID generation unit is configured to generate a chip ID signal. The chip ID transmission unit is configured to output the chip ID signal to a common line on the basis of whether another chip is electrically coupled therewith. The chip stack information generation unit is configured to be electrically coupled with the common line in response to the chip ID signal and generate a stack information signal.