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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9916977 B1

PDFFull Text
Date of Patent:
Mar. 13, 2018

Filed:

Nov. 16, 2015

Low k dielectric deposition via uv driven photopolymerization

Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Patrick A. Van Cleemput, San Jose, CA (US);

Nicholas Muga Ndiege, Fremont, CA (US);

Jonathan D. Mohn, Saratoga, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:

Weaver Austin Villeneuve & Sampson LLP

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 21/469 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/687 (2006.01); H01L 23/532 (2006.01); H01L 21/285 (2006.01); C23C 16/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02348 (2013.01); H01L 21/0228 (2013.01); H01L 21/02123 (2013.01); H01L 21/02126 (2013.01); H01L 21/02203 (2013.01); H01L 21/02216 (2013.01); H01L 21/02271 (2013.01); H01L 21/02277 (2013.01); H01L 21/02315 (2013.01); H01L 21/3105 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01); C23C 16/00 (2013.01); H01L 21/02115 (2013.01); H01L 21/02274 (2013.01); H01L 21/28562 (2013.01); H01L 21/76844 (2013.01); H01L 23/53238 (2013.01);
Abstract

Provided are methods and apparatus for ultraviolet (UV) assisted capillary condensation to form dielectric materials. In some embodiments, a UV driven reaction facilitates photo-polymerization of a liquid phase flowable material. Applications include high quality gap fill in high aspect ratio structures and por sealing of a porous solid dielectric film. According to various embodiments, single station and multi-station chambers configured for capillary condensation and UV exposure are provided.

Find Patent Forward Citations

Van Cleemput, Patrick. (2018). Low k dielectric deposition via uv driven photopolymerization (U.S. Patent No. 9916977). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9916977

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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