The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Mar. 25, 2016
Applicant:

The Florida State University Research Foundation, Inc., Tallahassee, FL (US);

Inventors:

Hom Kandel, Tallahassee, FL (US);

Jun Lu, Tallahassee, FL (US);

Youri Viouchkov, Tallahassee, FL (US);

Scott Gundlach, Tallahassee, FL (US);

Adam Voran, Tallahassee, FL (US);

William D. Markiewicz, Monticello, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/31 (2006.01); C04B 28/24 (2006.01); C09D 183/02 (2006.01); C08L 83/02 (2006.01); H01B 3/12 (2006.01); H01B 13/16 (2006.01); H01F 6/06 (2006.01); H01F 41/12 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 41/127 (2013.01); C04B 28/24 (2013.01); H01F 6/06 (2013.01); H01F 41/048 (2013.01);
Abstract

Electrically insulating AlO—SiOthin coatings have been deposited on long-length 316 stainless steel (SS) tape using a reel-to-reel continuous sol-gel dip coating process for co-winding insulation into YBCO pancake coils, a high temperature superconductor magnet technology. Coatings with a thickness of ˜2 μm are achieved after just one dip with a tape withdrawal speed of ˜16 mm/s (1 m/min) and a calcination at 700° C. The coatings were measured to have a room-temperature breakdown voltage of about 100 V, corresponding to a dc dielectric strength of about 50 MV/m. Consequently, this process has low cost and high throughput and produces a thin electrical insulation with excellent thermal, dielectric, and mechanical properties. A new technique has been developed in the coating process to mitigate coating buildup near the edges of the tape.


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