The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Jun. 28, 2016
Applicant:

Excelitas Technologies Singapore Pte Ltd., Singapore, SG;

Inventors:

Piotr Kropelnicki, Nusajaya, MY;

Radu M. Marinescu, Pointe-Claire, CA;

Grigore D. Huminic, Baie D'Urfe, CA;

Hermann Karagoezoglu, Wiesbaden, DE;

Kai Liang Chuan, Singapore, SG;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 5/20 (2006.01); G01J 5/12 (2006.01); G01J 5/06 (2006.01); H01L 31/09 (2006.01); H01L 35/32 (2006.01); H01L 35/34 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
G01J 5/12 (2013.01); G01J 5/061 (2013.01); H01L 31/09 (2013.01); H01L 31/1804 (2013.01); H01L 31/1828 (2013.01); H01L 31/1856 (2013.01); H01L 35/32 (2013.01); H01L 35/34 (2013.01); G01J 2005/065 (2013.01);
Abstract

An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wafer transfer technique in which a substrate assembly comprising the substrate and new thermally isolating material is bonded to a carrier substrate assembly comprising a carrier substrate and the ultra-thin material, followed by removal of the carrier substrate. As such, temperature restrictions of the various materials are overcome.


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