The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

May. 18, 2016
Applicant:

Schott Ag, Mainz, DE;

Inventors:

Bianca Schreder, Sulzbach, DE;

Marten Walther, Alfeld, DE;

Martin Feichtinger, Delligsen, DE;

Lothar Niessner, Duingen, DE;

Carsten Renz, Eschershausen, DE;

Sean Qian, Shanghai, CN;

Junming Xue, Shanghai, CN;

Assignee:

SCHOTT AG, Mainz, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 3/095 (2006.01); C03C 23/00 (2006.01); C03C 4/04 (2006.01); C03B 17/06 (2006.01);
U.S. Cl.
CPC ...
C03C 3/095 (2013.01); C03C 4/04 (2013.01); C03C 23/002 (2013.01); C03B 17/064 (2013.01); C03B 17/067 (2013.01); C03C 2204/00 (2013.01);
Abstract

A sensitized, photo-structurable glasses and methods for producing are provided. The glasses includes Si, one or more crystal-agonist, one or more crystal-antagonist, and one or more pair of nucleating agents. The glasses are sensitized in that the glass reacts more sensitive to irradiation with UV-light and can be crystallized easier and with higher aspect ratios than a non-sensitized glass with equal composition. Furthermore, the sensitized glasses of this invention have smaller crystal sizes after irradiation and tempering than a non-sensitized glass with equal composition. The invention also relates to a structured glass product. Such product can be obtained by submitting the crystallized glass product to a subsequent etching step. The structured product can be used in components or as component for the application fields micro-technology, micro-reaction-technology, electronic packaging, micro-fluidics, FED spacer, bio-technology, interposer, and/or three-dimensional structured antennae.


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