The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Jul. 18, 2016
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Thomas Buck, Gerlingen-Schillerhoehe, DE;

Fabian Purkl, Gerlingen, DE;

Michael Stumber, Korntal-Muenchingen, DE;

Rolf Scheben, Reutlingen, DE;

Benedikt Stein, Stuttgart, DE;

Christoph Schelling, Stuttgart, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); H04R 17/02 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0072 (2013.01); H04R 17/02 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.


Find Patent Forward Citations

Loading…