The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Mar. 02, 2016
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Hiroshi Higuchi, Atsugi, JP;

Masataka Kato, Hiratsuka, JP;

Yoshinao Ogata, Fukushima, JP;

Toshiyasu Sakai, Kawasaki, JP;

Takayuki Kamimura, Kawasaki, JP;

Tetsushi Ishikawa, Tokyo, JP;

Atsunori Terasaki, Kawasaki, JP;

Masahiko Kubota, Tokyo, JP;

Ryoji Kanri, Zushi, JP;

Yoshiyuki Fukumoto, Kawasaki, JP;

Yasuaki Tominaga, Kawasaki, JP;

Tamaki Sato, Kawasaki, JP;

Masafumi Morisue, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B41J 2/00 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
B41J 2/00 (2013.01); B41J 2/1601 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/14 (2013.01); B41J 2/14072 (2013.01); B41J 2/1643 (2013.01); H01L 21/565 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01);
Abstract

A method for manufacturing a structure having a substrate in which holes are formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes includes a process of preparing a substrate in which holes formed by a surface in which a wavelike shape is formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes and an exposure process of exposing the photosensitive resin layer on the substrate.


Find Patent Forward Citations

Loading…