The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2018
Filed:
Sep. 17, 2015
Honeywell International Inc., Morristown, NJ (US);
Don Mittendorf, Mesa, AZ (US);
Christopher David Gatto, Gilbert, AZ (US);
Leticia Lara, Phoenix, AZ (US);
Megan Kemp, Chandler, AZ (US);
Andy Szuromi, Phoenix, AZ (US);
HONEYWELL INTERNATIONAL INC., Morris Plains, NJ (US);
Abstract
A method for transient liquid phase bonding two metallic substrate segments together including the steps of forming a joined component by bringing together the two substrate segments along a bond line with a brazing alloy comprising a melting point depressant disposed between the two segments at the bond line and performing a first thermal treatment including heating the joined component at a brazing temperature of the brazing alloy for a first period of time. The method further includes performing a second thermal treatment including heating the joined component at an intermediate temperature that is above the brazing temperature but below a gamma prime solvus temperature of the substrate segments for a second period of time and performing a third thermal treatment including heating the joined component at a super-solvus temperature that is above the gamma prime solvus temperature of the two metallic substrate segments for a third period of time.