The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
May. 15, 2017
Lg Innotek Co., Ltd., Seoul, KR;
Yun Mi Bae, Seoul, KR;
Soon Gyu Kwon, Seoul, KR;
Sang Hwa Kim, Seoul, KR;
Sang Young Lee, Seoul, KR;
Jin Hak Lee, Seoul, KR;
Han Su Lee, Seoul, KR;
Dong Hun Jeong, Seoul, KR;
In Ho Jeong, Seoul, KR;
Dae Young Choi, Seoul, KR;
Jung Ho Hwang, Seoul, KR;
LG INNOTEK CO., LTD., Seoul, KR;
Abstract
A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein a width of a bottom surface of the surface treatment layer is narrower than a width of a top surface of the plating seed layer, wherein the bottom surface of the surface treatment layer includes: a first portion contacted with the circuit pattern layer; and a second portion non contacted with the circuit pattern layer, and wherein a width of a top surface of the circuit pattern layer is narrower than a width of a bottom surface of the circuit pattern layer.