The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Aug. 15, 2014
Applicant:

Point Engineering Co., Ltd., Asan-si, Chungcheongnam-do, KR;

Inventors:

Bum Mo Ahn, Yongin-si, KR;

Seung Ho Park, Hwaseong-si, KR;

Kyoung Ja Yun, Cheonan-si, KR;

Assignee:

Point Engineering Co., Ltd., Asan-si, Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 7/00 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H05K 3/0052 (2013.01); H01L 33/48 (2013.01); H01L 33/62 (2013.01); H01L 2924/0002 (2013.01); H05K 1/183 (2013.01); H05K 2201/09718 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/09863 (2013.01); H05K 2201/10 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); Y10T 29/49155 (2015.01);
Abstract

A base substrate which prevents burrs generated during the cutting process includes: multiple conductive layers stacked in one direction with respect to the base substrate; at least one insulation layer being alternately stacked with said conductive layers and electrically separating said conductive layers; and a through-hole penetrating said base substrate covering said insulation layer at the contact region where said cut surface and said insulation layer meet during the cutting of said base substrate in accordance with a predetermined region of the chip substrate. A method of manufacturing the base substrate includes alternately stacking conductive layers and insulation layers and forming a through-hole.


Find Patent Forward Citations

Ahn, Bum. (2018). Base substrate which prevents burrs generated during the cutting process and method for manufacturing the same (U.S. Patent No. 9913381). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9913381

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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