The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Apr. 18, 2017
Delta Electronics Int'l (Singapore) Pte Ltd, Singapore, SG;
Yiu-Wai Lai, Singapore, SG;
Da-Jung Chen, Singapore, SG;
DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD, Singapore, SG;
Abstract
An embedded package structure includes an insulation substrate, a first conductive layer, a second conductive layer, an electronic component and a passive component. The insulation substrate has a first conductive via and a second conductive via. The first conductive layer is formed on a top surface of the insulation substrate and contacted with the first conductive via. The second conductive layer is formed on a bottom surface of the insulation substrate, and contacted with the second conductive via. The electronic component is embedded within the insulation substrate. Moreover, plural conducting terminals of the electronic components are electrically connected with the first conductive layer and the second conductive layer through the first conductive via and the second conductive via. The passive component is located near a first side of the electronic component and separated from the electronic component. The passive component is at least partially embedded within the insulation substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile