The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Mar. 11, 2014
Applicant:
Schweizer Electronic Ag, Schramberg, DE;
Inventors:
Thomas Gottwald, Dunningen, DE;
Alexander Neumann, Rottweil, DE;
Assignee:
SCHWEIZER ELECTRONIC AG, Schramberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/18 (2006.01); H01L 23/14 (2006.01); H01L 23/367 (2006.01); H01L 23/538 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/142 (2013.01); H01L 23/3677 (2013.01); H01L 23/5389 (2013.01); H05K 1/0201 (2013.01); H05K 1/111 (2013.01); H05K 3/0047 (2013.01); H05K 3/0094 (2013.01); H05K 3/284 (2013.01); H05K 3/32 (2013.01); H05K 3/42 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/09036 (2013.01);
Abstract
Electronic sub-assembly comprising a carrier layer and a mounting area with at least one electronic component, wherein the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer, and wherein at least one compensation layer is provided on the carrier layer adjacent to the installation area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided.