The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Dec. 05, 2016
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventor:

Yoshito Fujimura, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/05 (2006.01); G11B 5/48 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); G11B 5/483 (2015.09); G11B 5/4853 (2013.01); H05K 1/0313 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/0023 (2013.01); H05K 2201/10083 (2013.01);
Abstract

A suspension board with circuit includes a metal supporting board, a conductor layer having a terminal capable of being electrically connected to the piezoelectric element and disposed above the metal supporting board at spaced intervals thereto, a first insulating layer disposed between the metal supporting board and the conductor layer so as to support the conductor layer, and a second insulating layer disposed on the first insulating layer and the conductor layer so as to expose the terminal. The first insulating layer includes a first portion including the terminal viewed from a thickness direction of the metal supporting board and a second portion disposed in a position different from that of the first portion viewed from the thickness direction. The thickness of the first portion is thinner than that of the second portion.


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