The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Jun. 16, 2014
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Cyrous Rostamzadeh, Northville Township, MI (US);

Shijie Wang, Windsor, CA;

Rajesh Das, Canton, MI (US);

Steven Gladstein, Farmington Hills, MI (US);

Timothy Foster, Saline, MI (US);

Allen Marecki, Plymouth, MI (US);

Sanjai Master, Canton, MI (US);

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 1/00 (2006.01); H05B 41/28 (2006.01); H02M 1/12 (2006.01); H02M 1/42 (2007.01); H02M 1/44 (2007.01); H05B 37/02 (2006.01); H05B 41/24 (2006.01); H02M 7/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05B 41/2806 (2013.01); H02M 1/12 (2013.01); H02M 1/42 (2013.01); H02M 1/44 (2013.01); H02M 7/003 (2013.01); H05B 37/0272 (2013.01); H05B 41/24 (2013.01); H02M 2001/123 (2013.01); H05K 1/0234 (2013.01);
Abstract

A connected light node (CLN) induction light ballast module for powering an induction lamp includes a printed circuit board having components mounted thereon and an earth ground region electrically isolated from a PCB ground region. A heat sink is disposed on a lower layer of the printed circuit board and electrically connected to the earth ground region, wherein a parasitic capacitance occurs between the printed circuit board ground region and the heat sink. A capacitive shield sandwiched by a lower insulating pad and an upper insulating pad is electrically isolated from the heat sink supporting the shield. A damping network electrically connects the capacitive shield to the PCB ground region. Switch-mode power converters are mounted above the upper insulating pad and the shield. The damping network suppresses noise by a parasitic capacitance between the PCB ground region and the heat sink during high frequency power converter operation.


Find Patent Forward Citations

Loading…