The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Nov. 27, 2013
Applicant:

Starkey Laboratories, Inc., Eden Prairie, MN (US);

Inventors:

John Dzarnoski, Eden Prairie, MN (US);

Susie Krzmarzick, Eden Prairie, MN (US);

Douglas F. Link, Plymouth, MN (US);

David Prchal, Hopkins, MN (US);

Assignee:

Starkey Laboratories, Inc., Eden Prairie, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 31/00 (2006.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H01R 13/24 (2006.01);
U.S. Cl.
CPC ...
H04R 25/608 (2013.01); H04R 25/658 (2013.01); H04R 31/00 (2013.01); H01R 12/7076 (2013.01); H01R 12/714 (2013.01); H01R 13/2414 (2013.01); H01R 2201/12 (2013.01); H04R 2225/021 (2013.01); H04R 2225/023 (2013.01); H04R 2225/025 (2013.01); Y10T 29/49005 (2015.01);
Abstract

Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.


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