The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Jul. 26, 2013
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Yoshiyuki Sasada, Hitachinaka, JP;

Satoshi Yamazaki, Hitachinaka, JP;

Ken Ohsumi, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 13/02 (2006.01); G03B 35/08 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H04N 13/0239 (2013.01); G03B 35/08 (2013.01); H04N 5/2252 (2013.01); H04N 5/2253 (2013.01); H04N 13/0296 (2013.01);
Abstract

To provide a stereo camera device capable of maintaining performance and reliability, while realizing thickness reduction, provided are a first image pickup device, a first communication connection unit to output a first image captured with the first image pickup device, a first image pickup substrate where the first image pickup device and the first communication connection unit are provided, a second image pickup device, a second communication connection unit to output a second image captured with the second image pickup device, a second image pickup substrate where the second image pickup device and the second communication connection unit are provided, and a housing where the first image pickup substrate is provided at one end and the second image pickup substrate is provided at another end. In the first image pickup substrate, the first image pickup device and the first communication connection unit are provided in parallel with each other in a lengthwise direction of the housing. In the second image pickup substrate, the second image pickup device and the second communication connection unit are provided in parallel with each other in the lengthwise direction of the housing. The first image pickup substrate and the second image pickup substrate are symmetrically provided.


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