The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Oct. 23, 2012
Applicant:
Micro Crystal Ag, Grenchen, CH;
Inventors:
Assignee:
Micro Crystal AG, Grenchen, CH;
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/007 (2006.01); H03H 3/02 (2006.01); B81C 1/00 (2006.01); H03H 9/02 (2006.01); H03H 3/04 (2006.01);
U.S. Cl.
CPC ...
H03H 3/0072 (2013.01); B81C 1/00269 (2013.01); H03H 3/02 (2013.01); H03H 3/04 (2013.01); H03H 9/02244 (2013.01); H03H 2003/022 (2013.01); H03H 2003/026 (2013.01); H03H 2003/0478 (2013.01); H03H 2003/0485 (2013.01); H03H 2003/0492 (2013.01); Y10T 29/42 (2015.01); Y10T 29/49005 (2015.01); Y10T 29/49574 (2015.01);
Abstract
An element is arranged to cooperate with another part so as to form an encapsulation device for a component including the element at least partially coated with a metallization. The metallization includes at least one metal layer protected by an intermetallic compound which is coated by a non-diffused portion of a material whose melting point is lower than 250° C. A method of fabricating the encapsulation device is also disclosed.