The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Jun. 16, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventor:

Philip G. Emma, Danbury, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 25/00 (2006.01); H01L 33/64 (2010.01); H01L 23/44 (2006.01); H01L 23/42 (2006.01); H01L 31/12 (2006.01); H01L 25/075 (2006.01); H01L 23/02 (2006.01); H01L 23/46 (2006.01); H01L 21/52 (2006.01); H01L 23/34 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/52 (2013.01); H01L 23/02 (2013.01); H01L 23/34 (2013.01); H01L 23/42 (2013.01); H01L 23/44 (2013.01); H01L 23/46 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 25/0756 (2013.01); H01L 31/12 (2013.01); H01L 33/641 (2013.01); H01L 33/642 (2013.01); H01L 33/648 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract

In one embodiment, the disclosure relates to a system of stacked and connected layers of circuits that includes at least one pair of adjacent layers having very few physical (electrical) connections. The system includes multiple logical connections. The logical interconnections may be made with light transmission. A majority of physical connections may provide power. The physical interconnections may be sparse, periodic and regular. The exemplary system may include physical space (or gap) between the a pair of adjacent layers having few physical connections. The space may be generally set by the sizes of the connections. A constant flow of coolant (gaseous or liquid) may be maintained between the adjacent pair of layers in the space.


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