The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Jan. 02, 2014
Applicant:
Mitsui High-tec, Inc., Fukuoka, JP;
Inventor:
Takahiro Ishibashi, Fukuoka, JP;
Assignee:
MITSUI HIGH-TEC, INC., Fukuoka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01);
Abstract
A lead frame includes adjacent die pads which lie adjacent to each other; grounding leads extended from the adjacent die pads; a connecting bar by which the grounding leads extended from the adjacent die pads are interconnected. The grounding leads and the connecting bar are formed to be thinner at one surface than a maximum thickness of leads of the lead frame, the grounding leads extended from the adjacent die pads are aligned on a common axis while providing the connecting bar between the grounding leads, and a support projection is provided at the one surface on the connecting bar in the common axis.