The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Jul. 01, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); H01L 22/32 (2013.01); H01L 24/05 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0562 (2013.01); H01L 2224/05093 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05576 (2013.01); H01L 2224/05616 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06155 (2013.01); H01L 2224/06156 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48229 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor device includes a main pad part and a sub pad part formed in a peripheral area of at least one side of the main pad part. The sub pad part is spaced apart from the main pad part. The sub pad part operates in a first state in which the sub pad part is short-circuited with the main pad part or in a second state in which the sub pad part is open from the main pad part.