The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Mar. 13, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Yosuke Nakata, Tokyo, JP;
Masayoshi Tarutani, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 23/498 (2013.01); H01L 24/01 (2013.01); H01L 24/03 (2013.01); H01L 24/08 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 24/48 (2013.01); H01L 2224/034 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73251 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/2065 (2013.01); H01L 2924/20641 (2013.01); H01L 2924/20642 (2013.01); H01L 2924/20643 (2013.01); H01L 2924/20644 (2013.01); H01L 2924/20645 (2013.01); H01L 2924/20646 (2013.01); H01L 2924/20647 (2013.01); H01L 2924/20648 (2013.01); H01L 2924/20649 (2013.01); H01L 2924/351 (2013.01);
Abstract
A semiconductor device of the present invention includes a semiconductor element, a surface electrode formed on a surface of the semiconductor element, a metal film formed on the surface electrode so as to have a joining portion and a stress relieving portion formed so as to border on and surround the joining portion, solder joined to the joining portion while avoiding the stress relieving portion, and an external electrode joined to the joining portion through the solder.