The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Jan. 26, 2016
Applicant:

Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd., Zhuhai, CN;

Inventors:

Dror Hurwitz, Zhuhai, CN;

Alex Huang, Zhuhai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/538 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 23/3736 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/53238 (2013.01); H01L 2224/18 (2013.01);
Abstract

A structure consisting of at least one die embedded in a polymer matrix and surrounded by the matrix, and further consisting of at least one through via through the polymer matrix around perimeter of the die, wherein typically the at least one via has both ends exposed and where the die is surrounded by a frame of a first polymer matrix and the at least one through via passes through the frame; the die is positioned with terminals on a lower surface such that the lower surface of the chip is coplanar with a lower surface of the frame, the frame is thicker than the chip, and metal is directly attached to and covers at least part of the upper surface of the chip.


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