The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Mar. 17, 2015
Boe Technology Group Co., Ltd., Beijing, CN;
Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;
Jiuxia Yang, Beijing, CN;
Feng Bai, Beijing, CN;
Liang Zhang, Beijing, CN;
Xu Chen, Beijing, CN;
Ang Xiao, Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
BEIJING BOE OPTOTECHNOLOGY CO., LTD., Beijing, CN;
Abstract
The present disclosure discloses an encapsulation system and an encapsulation method, the encapsulation system including a thickness detection unit, an output control unit and an energy output unit, the thickness detection unit being connected with the output control unit, and the output control unit being connected with the energy output unit. The thickness detection unit is configured to detect a thickness of an encapsulant at a to-be-heated location in a component to be encapsulated and generate corresponding thickness information. The output control unit is configured to generate corresponding output control information depending on the thickness information. The energy output unit is configured to output, depending on the output control information, to the encapsulant at the to-be-heated location energy for heating the encapsulant.