The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Nov. 10, 2014
Applicant:

Saedge Vision Solutions Pte. Ltd., Singapore, SG;

Inventors:

Ah Kow Chin, Singapore, SG;

Choong Fatt Ho, Singapore, SG;

Victor Vertoprakhov, Singapore, SG;

Soon Wei Wong, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); G01N 21/88 (2006.01); G01N 21/952 (2006.01); H01L 21/67 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
H01L 22/14 (2013.01); G01N 21/8851 (2013.01); G01N 21/9501 (2013.01); G01N 21/952 (2013.01); H01L 21/67288 (2013.01); H01L 22/12 (2013.01); H01L 24/48 (2013.01); G01N 21/95 (2013.01); H01L 2224/4809 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01);
Abstract

There is provided an apparatus and method for inspecting a semiconductor package. The apparatus includes at least one 3D camera positioned at a first angle relative to a normal axis of the semiconductor package; and a light source configured to provide illumination for the at least one 3D camera, the light source being directed at the semiconductor package. The method includes casting a shadow of a bonded wire onto the semiconductor package; obtaining a 3D image of the semiconductor package; determining a distance S of the shadow and the bonded wire in the image; and obtaining a wire loop height H of the bonded wire.


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