The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Aug. 06, 2014
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Taiji Sakai, Yokohama, JP;
Nobuhiro Imaizumi, Atsugi, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/762 (2006.01); H01L 23/488 (2006.01); G21K 5/02 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); B23K 20/02 (2006.01); B23K 20/24 (2006.01); B23K 20/26 (2006.01); H01L 21/268 (2006.01); H01L 21/3213 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76254 (2013.01); B23K 20/026 (2013.01); B23K 20/24 (2013.01); B23K 20/26 (2013.01); G21K 5/02 (2013.01); H01L 21/2686 (2013.01); H01L 21/32134 (2013.01); H01L 21/67017 (2013.01); H01L 21/67069 (2013.01); H01L 21/67092 (2013.01); H01L 21/67115 (2013.01); H01L 21/67144 (2013.01); H01L 23/488 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); B23K 2201/42 (2013.01); H01L 2224/118 (2013.01); H01L 2224/1182 (2013.01); H01L 2224/1184 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11845 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16501 (2013.01); H01L 2224/757 (2013.01); H01L 2224/7525 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/8101 (2013.01); H01L 2224/81002 (2013.01); H01L 2224/8102 (2013.01); H01L 2224/818 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/81013 (2013.01); H01L 2224/81014 (2013.01); H01L 2224/8122 (2013.01); H01L 2224/81031 (2013.01); H01L 2224/81047 (2013.01); H01L 2224/81054 (2013.01); H01L 2224/81075 (2013.01); H01L 2224/8183 (2013.01); H01L 2224/81097 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81907 (2013.01); H01L 2224/81986 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/2021 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/20108 (2013.01);
Abstract
According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.