The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Sep. 01, 2015
Applicants:

Boris Kesil, Santa Clara, CA (US);

Elik Gershenzon, Santa Clara, CA (US);

Inventors:

Boris Kesil, Santa Clara, CA (US);

Elik Gershenzon, Santa Clara, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25J 15/06 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01); B25J 15/00 (2006.01); B25J 9/16 (2006.01); B25J 13/08 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); B25J 9/1679 (2013.01); B25J 13/087 (2013.01); B25J 15/0028 (2013.01); B25J 15/0066 (2013.01); B25J 15/0616 (2013.01); H01L 21/67259 (2013.01); H01L 21/67294 (2013.01); H01L 21/68735 (2013.01);
Abstract

Proposed is a universal gripping and suction chuck for use as an interchangeable end effector of a robot arm of a robotic station capable of picking up, transporting, and handling objects having colors and outlines. The chuck housing contains elements of a vacuum system for holding the object by vacuum suction force, a vortex system for holding the objects in a non-contact manner in a state of levitation, and a mechanical edge gripper. The vacuum system, the vortex system, and the mechanical edge gripper can be selectively activated by commands from the central processing system that receives a signal recognition signal, object presence/absence signal and/or object approaching signal from respective sensors and depending on the type of the object recognized by the respective sensor. As a result, the chuck can pick up and handle such different objects as solid semiconductor wafer, paper or fabric interleaves, or small-diameter rings.


Find Patent Forward Citations

Loading…