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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9911639 B1

PDFFull Text
Date of Patent:
Mar. 06, 2018

Filed:

Jul. 29, 2015

Composite substrate, elastic wave device, and method for producing elastic wave device

Applicant:

Ngk Insulators, Ltd., Aichi, JP;

Inventors:

Ryosuke Hattori, Ichinomiya, JP;

Yuji Hori, Owariasahi, JP;

Tomoyoshi Tai, Inazawa, JP;

Assignee:

NGK INSULATORS, LTD., Aichi, JP;

Attorneys:

Cermak Nakajima & McGowan LLP

Tomoko Nakajima

Primary Examiner:

Jack Chen

Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/683 (2006.01); B32B 38/10 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 7/02 (2006.01); H03H 9/25 (2006.01); H03H 3/10 (2006.01); B32B 7/06 (2006.01); B32B 18/00 (2006.01); H01L 21/78 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); H01L 41/187 (2006.01); H03H 9/02 (2006.01); B32B 37/10 (2006.01); H03H 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 7/02 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/04 (2013.01); B32B 18/00 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/283 (2013.01); B32B 38/10 (2013.01); H01L 21/78 (2013.01); H03H 3/10 (2013.01); H03H 9/25 (2013.01); B32B 37/10 (2013.01); B32B 2264/105 (2013.01); B32B 2307/20 (2013.01); B32B 2307/206 (2013.01); B32B 2307/538 (2013.01); B32B 2309/02 (2013.01); B32B 2309/105 (2013.01); B32B 2457/00 (2013.01); B32B 2457/14 (2013.01); H01L 41/1873 (2013.01); H03H 3/08 (2013.01); H03H 9/02574 (2013.01); Y10T 428/12597 (2015.01);
Abstract

A composite substrateis formed by bonding together a piezoelectric substrateand a support substratethat has a lower thermal expansion coefficient than the piezoelectric substrate. The support substrateis formed by directly bonding together a first substrateand a second substrateat a strength that allows separation with a blade, the first and second substrates being formed of the same material, and a surface of the first substrateis bonded to the piezoelectric substrate, the surface being opposite to another surface of the first substratebonded to the second substrate

Find Patent Forward Citations

Quick Actions:

Hattori, Ryosuke. (2018). Composite substrate, elastic wave device, and method for producing elastic wave device (U.S. Patent No. 9911639). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9911639

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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