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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9911628 B1

PDFFull Text
Date of Patent:
Mar. 06, 2018

Filed:

Dec. 28, 2016

Semiconductor device leadframe

Applicant:

Ampleon Netherlands B.v., Nijmegen, NL;

Inventors:

Freek Egbert van Straten, Mook, NL;

Jeremy Joy Montalbo Incomio, Santa Rosa, PH;

Albertus Reijs, Molenhoek, NL;

Assignee:

Ampleon Netherlands B.V., Nijmegen, NL;

Attorney:

McDonnell Boehnen Hulbert & Berghoff LLP

Primary Examiner:

William Harriston

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H03F 3/193 (2006.01); H03F 3/21 (2006.01);
U.S. Cl.
CPC ...
H01L 21/566 (2013.01); H01L 21/4825 (2013.01); H01L 21/4882 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49551 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H03F 3/193 (2013.01); H03F 3/21 (2013.01); H01L 2224/48245 (2013.01); H03F 2200/451 (2013.01);
Abstract

For so called film assisted molding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.

Find Patent Forward Citations

van Straten, Freek. (2018). Semiconductor device leadframe (U.S. Patent No. 9911628). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9911628

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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