The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9910552 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 06, 2018

Filed:

Feb. 01, 2016
Applicant:

Fujikura Ltd., Tokyo, JP;

Inventors:

Takeshi Shiojiri, Chiba, JP;

Takaharu Hondo, Chiba, JP;

Assignee:

FUJIKURA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); H05K 1/0313 (2013.01); H05K 3/10 (2013.01); H05K 3/28 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); H05K 2201/09045 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H−H|<T/3 where His a maximum height of the second conductor wire in a first region corresponding to the first conductor wire in a first predetermined sectional surface crossing the wiring body along the second conductor wire, His a minimum height of the second conductor wire in a second region that is adjacent to the first region and has the same width as that of the first region in the first predetermined sectional surface, and Tis a thickness of the first conductor wire in the first predetermined sectional surface.


Find Patent Forward Citations

Shiojiri, Takeshi. (2018). Wiring body, wiring board, touch sensor, and method for producing wiring body (U.S. Patent No. 9910552). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9910552

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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