The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Dec. 14, 2016
Applicant:

Epcos Ag, Munich, DE;

Inventors:

Jan Ihle, Grambach, AT;

Andreas Peschka, Michendorf, DE;

Bert Hundertmark, Berlin, DE;

Benjamin Bohl, Berlin, DE;

Bernhard Ostrick, Teltow, DE;

Assignee:

EPCOS AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 19/14 (2006.01); G01L 19/06 (2006.01); G01L 19/00 (2006.01); G01L 19/04 (2006.01); C04B 35/185 (2006.01); C04B 35/626 (2006.01);
U.S. Cl.
CPC ...
G01L 19/141 (2013.01); C04B 35/185 (2013.01); C04B 35/626 (2013.01); G01L 19/0038 (2013.01); G01L 19/0084 (2013.01); G01L 19/04 (2013.01); G01L 19/0627 (2013.01); G01L 19/0681 (2013.01); C04B 2235/3463 (2013.01); C04B 2235/6022 (2013.01); C04B 2235/656 (2013.01);
Abstract

A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.


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