The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Dec. 25, 2013
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Atsushi Moriwaki, Tokyo, JP;

Shinsuke Tajiri, Tokyo, JP;

Kazuhiro Kamaya, Tokyo, JP;

Masanori Tsubouchi, Tokyo, JP;

Tsubasa Saito, Tokyo, JP;

Kazuhiro Yamada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01K 17/08 (2006.01); G01K 17/20 (2006.01);
U.S. Cl.
CPC ...
G01K 17/08 (2013.01); G01K 17/20 (2013.01);
Abstract

A heat flux sensor to be attached to a hole portion defined in a surface of an object includes a body portion having an outer circumferential face, and an exterior end face that is flush with the surface of the object. The body portion includes a plurality of bored holes extending from an outer face other than the exterior end face of the body portion, with respective tips of the bored holes being arranged on the same normal line of the exterior end face. The heat flux sensor further includes a plurality of heat sensors having wiring lines leading to the outer face of the body portion through the bored holes, and a filling material that fills the bored holes to seal the heat sensors.


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