The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Feb. 24, 2015
Applicant:

Nxp B.v., Eindhoven, NL;

Inventors:

Zoran Zivkovic, Hertogenbosch, NL;

Kim Phan Le, Eindhoven, NL;

Hilco Suy, Eindhoven, NL;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 1/02 (2006.01); G01K 3/08 (2006.01); G01K 7/00 (2006.01); H05K 1/00 (2006.01); H05K 3/00 (2006.01); G01K 7/16 (2006.01); G01K 7/42 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G01K 7/16 (2013.01); G01K 3/08 (2013.01); G01K 7/427 (2013.01); H04M 2250/12 (2013.01); H05K 1/0201 (2013.01); H05K 2201/10151 (2013.01);
Abstract

One example discloses a multi-sensor assembly, comprising: a first temperature sensor, having a first thermal profile; a second temperature sensor, having a second thermal profile different from the first thermal profile; wherein the first and second temperature sensors are mounted on a set of lead-frames; wherein the first and second temperature sensors include a first heat path input coupled to an ambient environment, and a second heat path input coupled to at least one of the lead-frames; and wherein the first and second sensors and set of lead-frames are included in a single multi-sensor assembly. Another example discloses a method of manufacture for the multi-sensor assembly.


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