The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Jun. 10, 2013
Applicant:

Michael J. Andres, Roscoe, IL (US);

Inventor:

Michael J. Andres, Roscoe, IL (US);

Assignee:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05D 23/02 (2006.01); H01M 10/63 (2014.01); F28F 13/00 (2006.01); H01M 10/6551 (2014.01); H01M 10/6554 (2014.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); H01M 10/655 (2014.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F28F 13/00 (2013.01); G05D 23/021 (2013.01); H01M 10/613 (2015.04); H01M 10/6551 (2015.04); H01M 10/6554 (2015.04); F28D 2021/0021 (2013.01); F28D 2021/0043 (2013.01); F28F 2013/008 (2013.01); H01M 10/625 (2015.04); H01M 10/655 (2015.04); H01M 2220/20 (2013.01);
Abstract

A system for controlling thermal conductivity between two thermal masses is disclosed. The system includes a first conduction body in thermal contact with a heat source and a second conduction body in contact with a heat sink. A thermal expansion component operatively connects to the first conduction body and moves the body between first and second positions at a predetermined temperature. In the first position the first conduction body is spaced apart from the second conduction body, thermally isolating the heat source from the heat sink. In the second position the first conduction body thermally contacts the second conduction body, and conducts heat from the heat source, through the conduction bodies and into the heat sink. Related methods are also described.


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