The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Dec. 21, 2016
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Jun Kawamata, Tokushima, JP;

Takao Kosugi, Anan, JP;

Assignee:

Nichia Corporation, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/48 (2010.01); F21V 9/16 (2006.01); F21V 7/22 (2006.01); G03B 21/20 (2006.01); F21V 29/502 (2015.01); G03B 21/16 (2006.01); F21V 13/08 (2006.01); G02B 5/08 (2006.01); H01L 33/50 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
F21V 29/502 (2015.01); F21V 7/22 (2013.01); F21V 13/08 (2013.01); G02B 5/0858 (2013.01); G03B 21/16 (2013.01); G03B 21/204 (2013.01); H01L 33/505 (2013.01); H01L 33/507 (2013.01); H01L 33/60 (2013.01); H01L 33/644 (2013.01);
Abstract

A wavelength converting device includes a heat dissipating member, a wavelength converting member, and a connecting member. The wavelength converting member is disposed on the heat dissipating member and contains a fluorescent material and a holding body including aluminum oxide, magnesium oxide, zirconium oxide, lutetium oxide, titanium oxide, chromium oxide, tungsten oxide, divanadium pentoxide, molybdenum trioxide, sodium oxide, yttrium oxide, silicon dioxide, boron oxide, or diphosphorus pentoxide. The connecting member contains a metal material and connecting the heat dissipating member and the wavelength converting member. The wavelength converting member includes an upper surface, side surfaces, and a lower surface. The connecting member is thermally connected to the side surfaces and the lower surface of the wavelength converting member.


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