The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Apr. 15, 2014
Applicant:
Mossey Creek Technologies Inc., Jefferson City, TN (US);
Inventor:
John Carberry, Talbott, TN (US);
Assignee:
Mossey Creek Technologies, Inc., Jefferson City, TN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 51/36 (2006.01); H01L 21/02 (2006.01); C30B 11/00 (2006.01); C30B 29/06 (2006.01); C30B 29/64 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
B29C 51/36 (2013.01); C30B 11/002 (2013.01); C30B 29/06 (2013.01); C30B 29/64 (2013.01); H01L 21/02035 (2013.01); H01L 31/1804 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract
A method of manufacturing a semiconductor includes providing a mold defining a planar capillary space; placing a measure of precursor in fluid communication with the capillary space; creating a vacuum around the mold and within the planar capillary space; melting the precursor; allowing the melted precursor to flow into the capillary space; and cooling the melted precursor within the mold such that the precursor forms a semiconductor, the operations of melting the precursor, allowing the precursor to flow into the capillary space, and cooling the melted precursor occurring in the vacuum.