The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Mar. 12, 2013
Applicants:

Shipu Cao, Pudong, Shanghai, CN;

Qingya Shen, Pudong, Shanghai, CN;

Wei Yan, Pudong, Shanghai, CN;

Xin Kong, Pudong, Shanghai, CN;

Pei Helen Sun, Pudong, Shanghai, CN;

Harold Ho, Pudong, Shanghai, CN;

Inventors:

Shipu Cao, Shanghai, CN;

Wei Yan, Shanghai, CN;

Qingya Shen, Shanghai, CN;

Xin Kong, Shanghai, CN;

Pei Helen Sun, Shanghai, CN;

Harold Ho, Shanghai, CN;

Assignee:

SABIC GLOBAL TECHNOLOGIES B.V., Bergen op Zoom, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 45/56 (2006.01); B29C 45/00 (2006.01); B29L 31/34 (2006.01); B29K 105/16 (2006.01); B29K 69/00 (2006.01); B29K 509/08 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14688 (2013.01); B29C 45/0013 (2013.01); B29C 45/0025 (2013.01); B29C 45/14065 (2013.01); B29C 45/561 (2013.01); B29C 45/14811 (2013.01); B29C 2045/14155 (2013.01); B29C 2045/14704 (2013.01); B29C 2045/14713 (2013.01); B29K 2069/00 (2013.01); B29K 2105/16 (2013.01); B29K 2509/08 (2013.01); B29L 2031/3481 (2013.01);
Abstract

A method for making a thin wall component comprise: locating a film () in a mold cavity of a mold, wherein the mold cavity has an initial mold thickness, wherein the film comprises a base layer () and a pattern layer (); injecting a molding material () into the mold cavity such that the molding material contacts the pattern layer, wherein the molding material comprises a polymeric material and a filler; compressing the mold to a final mold thickness that is less than the initial mold thickness, to form a molded product, wherein the pattern layer forms a surface of the molded product; and removing the molded product from the mold. A molded product formed by the method. The method produce a thin walled component without warpage, inner stresses, poor surface quality, or washout defects.


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