The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Sep. 04, 2015
Applicant:

Sumida Electric (H.k.) Company Limited, Hong Kong S.A.R., CN;

Inventors:

Hongnian Zhang, Hong Kong, CN;

Yanfei Liu, Kingston, CA;

Douglas James Malcolm, Algonquin, IL (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/28 (2006.01); H01F 27/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H01F 27/022 (2013.01); H05K 2201/086 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/1105 (2013.01); Y10T 29/49146 (2015.01);
Abstract

A power supply module and its manufacturing method are disclosed. The manufacturing method for the power supply module includes: configuring a coil such that coil terminals are configured by way of electrical connection in the preset circuit connection configuration of the connector; preparing a mold cavity, and placing the connector housed with the coil and the electronic components into the mold cavity; making a magnetic mixture, and filling the mold cavity where the connector is placed with the magnetic mixture to form a magnetic body under pressure, wherein the magnetic body encapsulates at least the coil, the electronic components and a portion of the connector adapted to house the coil and the electronic components, and the terminal is exposed outside the magnetic body; demolding the magnetic body from the mold cavity; and increasing the temperature of the demolded magnetic body by heating. In this way, the molding pressure for forming the power supply module is lower and the manufactured power supply module has good performance of heat transfer.


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