The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Jul. 03, 2014
Applicant:

Harman Becker Automotive Systems Gmbh, Karlsbad, DE;

Inventors:

Guenther Kraft, Karlsruhe, DE;

Krunoslac Orcic, Karlsruhe, DE;

Didier Berthomier, Villingen-Schwenningen, DE;

Thomas Schiemann, Karlsruhe, DE;

Valod Noshadi, Ettlingen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/38 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 23/38 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 25/16 (2013.01); H05K 1/0203 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 1/183 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/15153 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10219 (2013.01); H05K 2201/10734 (2013.01); Y02P 70/611 (2015.11);
Abstract

An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.


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