The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Feb. 02, 2016
Applicant:

Sunasic Technologies, Inc., New Taipei, TW;

Inventor:

Chi-Chou Lin, New Taipei, TW;

Assignee:

Sunasic Technologies, Inc., New Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); B42D 25/313 (2014.01); G06K 9/00 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/182 (2013.01); B42D 25/313 (2014.10); G06K 9/0002 (2013.01); H05K 1/115 (2013.01); H05K 1/183 (2013.01); H05K 3/4697 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/18 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H05K 3/0044 (2013.01); H05K 3/4046 (2013.01); H05K 3/421 (2013.01); H05K 3/4623 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10287 (2013.01); H05K 2203/0228 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49018 (2015.01); Y10T 29/49117 (2015.01);
Abstract

A printed circuit board having an electronic component embedded is disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.


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