The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

May. 17, 2016
Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventor:

Chih-Hao Lin, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/11 (2006.01); H01P 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0245 (2013.01); H01P 3/026 (2013.01); H05K 1/0216 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 2201/041 (2013.01); H05K 2201/093 (2013.01);
Abstract

A design for printed circuit board with reduced susceptibility to common-mode noise includes a first substrate, a differential pair of signal lines with two differential transmission lines laid on the first substrate, a second substrate, a metal layer located between the first substrate and the second substrate, and a grounding layer The second substrate is located between the second substrate and the grounding layer, and a conductive structure is located in the second substrate and couples the metal layer to the grounding layer. A length of the metal layer is substantially equal to a length of each of the two differential transmission lines.


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