The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Feb. 20, 2017
Applicant:

Delphi Technologies, Inc., Troy, MI (US);

Inventors:

Thomas A. Volpone, Cortland, OH (US);

Troy A. Iler, Salem, OH (US);

Assignee:

Delphi Techologies, Inc., Troy, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02G 1/00 (2006.01); H01B 7/00 (2006.01); H01B 7/282 (2006.01); H05K 9/00 (2006.01); H01B 5/02 (2006.01); H01B 13/012 (2006.01); H02G 15/18 (2006.01); H01R 4/02 (2006.01); H01R 4/70 (2006.01);
U.S. Cl.
CPC ...
H02G 1/005 (2013.01); H01B 5/02 (2013.01); H01B 7/0045 (2013.01); H01B 7/282 (2013.01); H01B 13/01209 (2013.01); H01R 4/029 (2013.01); H01R 4/70 (2013.01); H02G 15/18 (2013.01); H05K 9/0098 (2013.01);
Abstract

A wire cable assembly, such as those used in electric or hybrid electric vehicles, having a plurality of shielded wire cables that are spliced together is presented. The assembly includes a splicing device having a generally planar bus bar formed of a conductive material, wherein the exposed core conductors of the shielded wire cables are welded to the bus bar, thereby electrically interconnecting the exposed core conductors. A conductive sleeve encloses bus bar and interconnects the shield conductors of the shielded wire cables, providing shielding for the exposed core conductors and continuity for the shield conductors. An outer insulator enclosing the conductive sleeve. A method of splicing shielded wire cables using such a device is also presented herein.


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