The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Feb. 27, 2014
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventor:

Takahiro Oyu, Chiyoda-ku, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/18 (2013.01); H01L 33/486 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/351 (2013.01); H05K 1/189 (2013.01); H05K 2201/10106 (2013.01);
Abstract

The light emitting device including: a flexible substrate having a negative lead electrode and a positive lead electrode formed on an upper surface thereof; a light emitting element having a negative electrode and a positive electrode formed on an upper surface thereof; an insulating film formed on a side surface of the light emitting element; a wiring formed in contact with the insulating film for connecting between the negative electrode and the negative lead electrode, or between the positive electrode and the positive lead electrode.


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