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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9905738 B1

PDFFull Text
Date of Patent:
Feb. 27, 2018

Filed:

Mar. 10, 2015

Composition for encapsulant and encapsulant and electronic device

Applicant:

Samsung Sdi Co., Ltd., Yongi-si, Gyeonggi-do, KR;

Inventors:

Hong-Jung Yoo, Suwon-si, KR;

Young-Ho Kim, Suwon-si, KR;

Woo-Han Kim, Suwon-si, KR;

Doo-Ri Song, Suwon-si, KR;

Eun-Seon Lee, Suwon-si, KR;

Assignee:

Samsung SDI Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Attorney:

Lee & Morse, P.C.

Primary Examiner:

Bijan Ahvazi

Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 33/52 (2010.01); C09D 183/06 (2006.01); H01B 1/20 (2006.01); H01L 33/50 (2010.01); C08L 83/04 (2006.01); B82Y 30/00 (2011.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C08L 83/04 (2013.01); H01L 33/501 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08G 77/80 (2013.01); H01L 2224/48091 (2013.01);
Abstract

Provided are a composition for an encapsulant having a viscosity of about 4,000 to about 9,500 mPa·s when measured using a Brookfield (DV-II+pro) spindle No. 52 at a torque of about 90% under atmospheric pressure at about 23° C., whereby maintaining a phosphor precipitation degree within about 18% when including a phosphor and allowed to stand at about 23° C. for greater than or equal to about 2 hours, and including at least one first siloxane compound having a silicon-bonded hydrogen (Si—H) and at least one second siloxane compound having a silicon-bonded alkenyl group (Si-Vi), an encapsulant obtained by curing the composition, and an electronic device including the encapsulant.

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