The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
Jun. 10, 2015
Sang-uk Han, Hwaseong-si, KR;
Seungwon Park, Seoul, KR;
Un-byoung Kang, Hwaseong-si, KR;
Taeje Cho, Yongin-si, KR;
Sang-Uk Han, Hwaseong-si, KR;
Seungwon Park, Seoul, KR;
Un-Byoung Kang, Hwaseong-si, KR;
Taeje Cho, Yongin-si, KR;
Abstract
Embodiments of the inventive concepts provide a semiconductor package and a method of fabricating the same. The method includes forming a groove to separate first semiconductor chips from each other. Forming the groove include performing a first sawing process on a bottom surface of a semiconductor substrate to cut the semiconductor substrate and a portion of a mold layer in a direction inclined with respect to the bottom surface, and performing a second sawing process to cut the mold layer in a direction substantially perpendicular to the bottom surface of the semiconductor substrate. A minimum width of the groove formed in the semiconductor substrate by the first sawing process may be greater than a width of the groove formed in the mold layer by the second sawing process.