The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Oct. 27, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Kerry Bernstein, Underhill, VT (US);

Thomas Brunschwiler, Thalwil, CH;

Bruno Michel, Adliswil, CH;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/498 (2006.01); H01L 23/473 (2006.01); H01L 25/065 (2006.01); H01L 23/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/46 (2013.01); H01L 23/473 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/3011 (2013.01);
Abstract

An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and including an upper portion formed on a side of the chip, a lower portion formed on another side of the chip, and a cooling inlet and a cooling outlet for transferring a coolant, provided in an upper surface of the casing, and forming outer sidewalls of the upper portion and inner sidewalls of the lower portion, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board. The card includes an upper card connected to the upper portion of the casing, and a lower card connected to the lower portion of the casing.


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