The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9905501 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 27, 2018

Filed:

Nov. 22, 2016
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yasuhiro Sugaya, Osaka, JP;

Hidenori Katsumura, Hyogo, JP;

Shinya Tokunaga, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01G 4/33 (2006.01); H01G 4/228 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01G 4/40 (2006.01); H01G 4/224 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49589 (2013.01); H01G 4/224 (2013.01); H01G 4/228 (2013.01); H01G 4/33 (2013.01); H01G 4/40 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 24/97 (2013.01); H01L 25/00 (2013.01); H01L 23/4952 (2013.01); H01L 23/49551 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/181 (2013.01);
Abstract

Jitter that becomes a problem in a semiconductor part which performs high-speed signal processing is reduced. A semiconductor device includes a heat-resistant metal plate, a capacitor part having a lower electrode, a sintered dielectric part, and an upper electrode that are formed on one or more surfaces of the heat-resistant metal plate, a semiconductor chip fixed on the capacitor part, a wire for electrically connecting a lead frame to the semiconductor chip and the upper electrode, and a mold part in which at least the capacitor part and the semiconductor chip are buried. The semiconductor chip, the electrode, the metal plate, and the like are electrically connected with each other via first, second, and third wires.


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Sugaya, Yasuhiro. (2018). Semiconductor device, embedded capacitor unit, semiconductor package, and method of manufacturing embedded capacitor unit (U.S. Patent No. 9905501). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9905501

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