The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
Feb. 22, 2017
Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;
Shoji Yasunaga, Kyoto, JP;
Mamoru Yamagami, Kyoto, JP;
ROHM CO., LTD., Kyoto, JP;
Abstract
[Object] A semiconductor device is configured to release heat from semiconductor chips more efficiently. [Means for Solution] A semiconductor device includes: a die padwhich has a die pad main surfaceand a die pad rear surface; a semiconductor chipmounted on the die pad main surface; a sealing resin portionformed with a recessfor exposure of the die pad rear surfaceand covering the die padand the semiconductor chip; and a heat releasing layerdisposed in the recess. The recesshas a recess grooveoutside the die padin a direction in which the die pad rear surfaceextends, and the recess grooveis closer to the die pad main surfacethan to the die pad rear surface. The heat releasing layerhas a junction layer which is in contact with the die pad rear surfaceand having part thereof filling the recess groove